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Go from wafers
to analysis-ready samples in minutes quickly, easily, repeatedly and with
virtually no added costs of operation. The LatticeAx 420 High
Accuracy Cleaving (HAC) system delivers:
- 10 µm targeting
accuracy
- 3 µm imaging
resolution
- X-Y-R stages, microscope and color
CCD camera
- Fiber-optic
lighting
- No service
contract
- No annual
periodic maintenance
- Easy for user to
maintain
- Utilizes 1 - 2
diamond indenters per year (extreme low
cost/cleave)
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