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    §Ú­Ì¸Û¼°ªºÁܽбz ©ó99¦~10¤ë22¤é¡]¤­¡^°Ñ»P¥Ñ¬ü°êOmniprobe¤½¥q»PÁ`¥N²z °¶§ÞªÑ¥÷¦³­­¤½¥q¡A©ó·s¦Ë°ê»«¶º©±¦@¦PÁ|¿ìSEM & FIB¬ÛÃöªþÄݳ]³Æ¤ÎÀ³¥Î¬ã°Q·|¡COmniprobe¬O¨ÑÀ³SEM¤ÎFIB¬ÛÃöªþÄݳ]³Æªº°ê»Ú¯Å»â¾É¼t°Ó¡A­P¤O©ó´£¨Ñ¬ÛÃöªþÄÝÀ³¥Î³]³Æ¥H¥[±jSEM¤ÎFIBªºÀ³¥Î¥\¯à¡A¥HÀ°§U«È¤á´£¤É¬J¦³ªºSEM & FIB³]³Æ¹F¨ìNano-labªºÀ³¥Î¼h¦¸¡C

¦¹¦¸°¶§Þ¯S§OÁܽÐOmniprobe¥þ²y¦æ¾P¨ó²zEfrat Moyal¤ÎÀ³¥Î³¡¸g²zCheryl Hartfield¨Ó¥x¡A³z¹L¬ã°Q·|¬°¥xÆW«È¤á¤¶²Ð¥Ø«e°w¹ïTEM sample·Ç³Æ¡AGIS¨t²Î¬ÛÃö³Ì·sªºÀ³¥Î¤Î³ø§i¡A©¡®É³z¹L²{³õ¾÷¥x¤¶²Ð»P§Y®É°Q½×¡A¥H§Q«È¤á§ó²M·¡¤F¸Ñ¦p¦óµo´§²{¦³SEM & FIBªº¥\¯à»PÀ³¥Î¼h¦¸¡C

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SEM & FIB¬ÛÃöªþÄݳ]³Æ¤ÎÀ³¥Î¬ã°Q·| ijµ{²Ó¶µ

9:30

Coffee

10:00

FIB Strategies for TEM sample Preparation (H-bar, INLO - in situ lift-out , EXLO - ex situ lift-out)

10:30

In situ lamella cutting methods, advantages and disadvantages of each

11:00

Coffee Break

11:30

Reorienting the lamella for Plan-View TEM and Sideways Milling

12:00

Lift-Out Tips and Tricks

12:30

Backside Thinning and grid attach Strategies (Short-Cut ¡V ex-situ grid attach, double lift-out and more)

13:00

Lunch

14:00

Preparation for tomography

14:30

Gas Injection System ¡V SEM & FIB Applications:

„«Nanowire positioning

„«Plasmonic nanostructure & nanofabrication

„«Device assembly

„«e-beam lithography (ion beam as well)

„«electrical test structure

„«He microscope ¡V IBID

„«ALD ¡V Atomic Layer Deposition

15:30

Sample transfer system

Sensitive Sample Transfer between microscopes

16:00

Coffee  w/ Q&A

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