產品介紹

The copper EM-Tec FIB lift-out grids are available with either 2, 3, 4 or 5 posts. Thickness is 30-40µm, which makes them more rigid then standard TEM grids.
EM-Tec FIB lift-out grids undergo a unique cleaning process to reduce contamination; this results in improved mounting and imaging of the TEM lamellas.
Due to the manufacturing process, the copper FIB lift-out grids have a set-back ridge at the edge of the front side and exhibit smooth side walls.