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iCB Automatic Chip bonder
iStar develops The Innovative Equipment in the fields of Semiconductor, Pan-semiconductor, Precision Manufacturing, New energy and Biomedical fields ...
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iCB series products are automatic chip bonding equipment independently developed by iSTAR, which features automic high precision chip to chip, chip to wafer bonding, and is suitable for application as infrared sensor, Micro LED and chiplet etc.
| Model | iCB500 | iCB2000 | iCB3000 |
|---|---|---|---|
| Bottom Chip Size | 0.5mm-50mm | 0.5mm-200mm | 0.5mm-300mm |
| Bonding Accuracy | ±0.5μm/±1μm | ||
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