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iAB Automatic Wafer bonder
iStar develops The Innovative Equipment in the fields of Semiconductor, Pan-semiconductor, Precision Manufacturing, New energy and Biomedical fields ...
Introduction
iAB series automatic wafer bonder is independently developed by iSTAR for automatic wafer to wafer bonding applications.
| Model | iAB1500 | iAB2000 | iAB3000 |
|---|---|---|---|
| Wafer Size | 150mm | 200mm | 300mm |
| Bonding Accuracy | ≤±2μm | ≤±3μm | ≤±5μm |
