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iAB Automatic Wafer bonder

iStar develops The Innovative Equipment in the fields of Semiconductor, Pan-semiconductor, Precision Manufacturing, New energy and Biomedical fields ...

Introduction

iAB series automatic wafer bonder is independently developed by iSTAR for automatic wafer to wafer bonding applications.

Model iAB1500 iAB2000 iAB3000
Wafer Size 150mm 200mm 300mm
Bonding Accuracy ≤±2μm ≤±3μm ≤±5μm