Introduction

Resonance Ultrasonic Vibration (RUV) method uses an innovative approach to access mechanical quality of the full-size crystalline silicon (Si) wafers using patented technology. The model RUV-2 Core is specifically adopted to perform crack and stress detection providing an operator with a “Go/No-Go” signal for each measured unit. Data file contains entire rejection recipe (rejection thresholds, frequency window, etc.), measured RUV parameters – amplitude, bandwidth and peak position, and pass/fail indication.