iAS Large FOV Scanner

iAS series products are full FOV scanner independently developed by iSTAR, for high-end display applications, IC substrate, and advanced packaging, and applications such as large FOV exposure of MicroLED, IC substrate and Fan-out.

iAB Automatic Wafer bonder

iAB series automatic wafer bonder is independently developed by iSTAR for automatic wafer to wafer bonding applications.

iCB Automatic Chip bonder

iCB series products are automatic chip bonding equipment independently developed by iSTAR, which features automic high precision chip to chip, chip to wafer bonding, and is suitable for application as infrared sensor, Micro LED and chiplet etc.

SAICAS Interfacial Analysis System

SAICAS is used to measure the adhesion of paints and coatings by comparing peel strength, as well as to assess the shear strength of materials. The instrument also performs diagonal cutting as a pretreatment for surface analysis. Standard sample sizes range from flat plates approximately 20 x 20 mm to 50 x 50 mm, with a maximum thickness of 10 mm. As the need to evaluate the peelability, adhesion, and strength of thin films—such as submicron and multilayer films—grows, reliable methods are scarce. These evaluations are challenging due to the impact of the material’s strength and structure. However, the surface and interface property analyzer addresses this issue by measuring the adhesion and shear strength of thin films through a cutting method.

ECV PROFILER CVP21

The Wafer Profiler CVP21 is an essential tool for measuring doping profiles in semiconductor layers using Electrochemical Capacitance Voltage Profiling (ECV-Profiling, CV-Profiling), making it ideal for both semiconductor research and production.

Evactron® Model E25 Plasma De-Contaminators™

The microprocessor-based Evactron® E25 simplifies plasma operation with factory-programmed settings stored in its internal memory, reducing the need for extensive operator training. The compact, tabletop controller features embedded software that regulates a leak valve and controls chamber pressure via a MicroPirani™ gauge. It also manages RF power and includes a built-in clock for timing downstream plasma cleaning and nitrogen purging cycles. Operational data and fault events are logged by the microprocessor. Users can adjust parameters using the Encoder Knob, with menu options displayed on the front panel. The Enable/Disable Button activates the system for plasma cleaning. Additionally, the RS232 interface allows communication of key parameters—such as RF power (forward and reflected), vacuum levels, and operational/fault logs—to a remote computer using the provided Graphical User Interface (GUI).

Evactron® E50 Plasma De-Contaminators™

The Evactron® E50 De-Contaminators are compact yet high-performance plasma cleaners designed for Electron and Ion Beam instruments, including SEMs, TEMs, and FIBs. The E50 delivers powerful cleaning to enhance resolution and imaging while improving detector and probe sensitivity, which can be compromised by contamination. With its high-power cleaning capabilities, the Evactron® E50 ensures fast and effective cleaning across a wide range of pressures, resulting in high-quality, artifact-free images and increased efficiency in sample analysis.

WSI-300

NV-F 2D/3D Hybrid Automation System - NV-F2700

The most advanced non-contact 3D surface profiler

NV-F 2D/3D Hybrid Automation System - NV-F3200

The most advanced non-contact 3D surface profiler